Universal APL

Universal Instruments Corporation Advanced Process Lab (UICAPL)

In today’s high-tech industries, knowledge makes the difference. Universal Instruments Corporation Advanced Process Laboratory (UICAPL) leverages extensive process and materials expertise to address current and next-generation technology challenges and maximize competitive advantage. The UICAPL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability. The UICAPL also plays a leading role in the greater electronics community, organizing research consortia, and building partnerships with academic and industry experts to identify and develop new and emerging technologies – those that will take electronic assembly far into the future.


Optimize your existing and emerging technology assembly challenges to bring quality products to market faster.

Process Support and Development

  • Efficient, cost-effective and robust assembly processes
  • Assembly expertise for traditional, emerging technologies and advanced packaging
  • Advanced packaging expertise: package assembly, ball attach, flip chip attach, thin die 30-50 microns
  • Applications review: assembly processes, materials and current yields
  • Materials analysis: PCBs, components, adhesives, solder paste, flux, underfill

Product Development and Assembly Services

  • Efficient, cost-effective and robust assembly processes
  • Maximize yields, minimize time to market
  • Prototyping and development, on complex small-lot builds, NPI through volume production
  • State-of-the-art in-house production lines
  • Optimized assembly solutions (design, materials, process, pioneering equipment technology) for new and existing products
  • Design for Manufacture (DfM) and Design for Reliability (DfR)

 Process Lab Information 


The UICAPL leverages exclusive expertise and specialized analytical tools to identify and decisively address production and field failures.

  • Mitigate/eliminate failures, from component-level to box build
  • Maximize yields and field reliability, minimize costly rework
  • Root Cause Failure Analysis
  • Analytical results are delivered in the context of the process and materials used for faster resolution
  • Detailed technical reports to support findings
  • Comprehensive analytical methods: Thermal Shadow Moiré (warpage analysis), Scanning Electron Microscope, Cross-Sections, Fourier Transform Infrared, ION Chromatography
  • Materials evaluation
  • Reliability testing (mechanical, environmental, vibration, drop shock)

 Analytical Information 

AREA CONSORTIUM (Advanced Research in Electronics Assembly)

Benefit from the UICAPL’s partnership with the industry’s leaders, generating fast-paced research and reports on leading-edge materials and processes.

  • Maximize your research investment through collaboration with industry leaders to identify and develop new and emerging technologies
  • Reduce development/implementation time, costs, and resources
  • PhD/MS qualified research staff with diverse backgrounds across Mechanical, Chemical and Materials Engineering disciplines
  • Vertically integrated research capability manufacturing, characterization, reliability testing , analysis and reporting
  • Research results shared at regularly scheduled member only  meetings
  • Collaborations with academic partners to address scientific and engineering challenges posed by members